Multi-layer PCB Design
Advanced Multi-layer PCB Design & Signal Integrity
Design complex multi-layer PCBs with advanced signal integrity analysis, EMI/EMC optimization, and high-speed design capabilities for demanding applications.
Professional Multi-layer Design Tools
Advanced capabilities for high-performance, complex PCB designs.
Stackup Design
Intelligent stackup planning with impedance control, layer assignment, and material selection for optimal performance.
Signal Integrity Analysis
Real-time signal integrity simulation with crosstalk analysis, timing verification, and eye diagram generation.
EMI/EMC Optimization
Built-in EMI/EMC analysis and optimization tools to ensure compliance with electromagnetic compatibility standards.
High-Speed Design
Specialized tools for high-speed digital design including differential pairs, length matching, and via optimization.
Power Integrity
Power distribution network analysis with DC drop simulation, AC impedance analysis, and decoupling optimization.
Manufacturing DFM
Design for manufacturing checks specific to multi-layer boards including via aspect ratios and layer registration.
Critical Applications Demand Excellence
Where performance and reliability are non-negotiable.
High-Speed Computing
Design PCBs for processors, memory interfaces, and high-speed communication systems with stringent timing requirements.
- DDR memory interfaces
- High-speed serial links
- Clock distribution networks
RF & Wireless Systems
Create RF and microwave circuits with precise impedance control, minimal loss, and optimal signal routing.
- RF transmission lines
- Antenna integration
- Isolation and shielding
Ready for Complex PCB Challenges?
Master multi-layer design with professional tools and expert guidance.